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AMD CEO to discuss 2nm and 3nm chip production with TSMC

AMD CEO to discuss 2nm and 3nm chip production with TSMC

AMD CEO Lisa Su along with a number of other senior company executives are set to visit Taiwan from late September to early November to discuss collaboration with local partners.
AMD will hold talks with TSMC, as well as chip packers and major PC manufacturers.image source: amd.comIn the course of visit, Suh will meet with TSMC CEO CC Wei and, in particular, discuss about production lines N3P (3nm process) and N2 (2nm process), reports DigiTimes, citing its own sources.
The executives will discuss upcoming orders using either existing or forthcoming technologies.AMD owes its success in the processor market in recent years, among other things, to TSMC's ability to produce cutting-edge products in large quantities.
To build on its success, AMD needs timely access to processor design kits (PDKs).
TSMC will launch mass production on N2 nodes in the second half of 2025, so AMD needs to negotiate now to incorporate the technology into 2026 products.Beyond advanced semiconductor manufacturing technology, AMD's success will also depend on packaging solutions-the company will continue to develop CPUs and GPUs from multiple chips (chipsets).
Today AMD already uses several advanced solutions, but in the future the need for different packaging technologies will only grow, and it is necessary to agree in advance on the production capacity and prices.
PCBs and substrates will be discussed with Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology.
Finally, AMD management will meet with ASUS and Acer, Taiwan's largest PC makers and long-time partners, as well as chipset developer ASMedia.

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