Taiwan-based company MediaTek today unveiled three new mobile processors for mid-range smartphones: Dimensity 1050, Dimensity 930 and Helio G99.All of the new products are systems-on-chip (SoC) based on a 6nm manufacturing process.Each chip has received eight computing cores.Image source: corp.mediatek.comMediaTek Dimensity 1050 is a \"lightweight\" version of the Dimensity 1100 model.However, at the same time, it is the company's first processor capable of connecting to 5G networks in the mmWave 5G and sub-6GHz bands.The Dimensity 1050 uses two 2.5GHz high-performance Arm Cortex-A78 cores.What energy efficient cores are used here - the manufacturer does not specify.Most likely, we are talking about Arm Cortex-A55.The chip also got a graphics core Arm Mali-610 with support for MediaTek HyperEngine 5.0.The latter provides additional tools and optimization features to improve performance in games. The Dimensity 1050 is announced to support UFS 3.1 flash memory, LPDDR5 standard RAM, Full HD+ resolution screens with refresh rate up to 144Hz, and AV1 decoding hardware capabilities.In addition, the manufacturer notes HDR10+ and Dolby Vision compatibility.Support for cameras up to 108 megapixels is also indicated.The MediaTek Dimensity 1050 offers 3CC carrier aggregation below 6 GHz (FR1) and 4CC carrier aggregation in the mmWave spectrum (FR2) and is claimed to offer up to 53% higher downlink speeds compared to LTE + mmWave aggregation.The MediaTek Dimensity 1050 also supports Wi-Fi 6E and 2x2 MIMO antenna for ultra-fast Wi-Fi connectivity.The first devices based on the MediaTek Dimensity 1050 should hit the market between July and September this year. The situation with the Dimensity 930 is quite strange.Despite the higher serial number of the chip, the frequency of its cores is lower than that of the previous Dimensity 920 and Dimensity 900 models.The new processor got two 2.2GHz Cortex-A78 cores and six 2GHz Cortex-A55 cores.The same Dimensity 900 and Dimensity 920 have 2.4GHz and 2.5GHz high performance cores, respectively.However, the manufacturer has equipped the Dimensity 930 with a brand new graphics subsystem.The IMG BXM-8-256 core is used here, which has never been seen in smartphones before.What it is capable of - still unknown.The company claims for the Dimensity 930 support for UFS 3.1 flash memory and LPDDR5 RAM, cameras with a resolution up to 108 megapixels with the ability to shoot video in 4K resolution at 30 frames per second, support for 5G, Wi-Fi 5, Bluetooth 5.2 and screens with Full HD+ resolution, 120 Hz refresh rate and HDR10+ The Helio G99 platform does not have 5G support.However, the company has moved the chip to a 6nm process.The new SoC is more energy efficient than its predecessors based on 12nm process technology.The Helio G99 uses two 2.2GHz Cortex-A76 cores, six 2GHz Cortex-A55 cores and a Mali-G57 MC2 graphics subsystem.The processor supports UFS 2.2 storage, LPDDR4X memory, 120Hz Full HD+ displays, and Wi-Fi 5 and Bluetooth 5.2 wireless standards.In addition, support for 108-megapixel cameras is indicated, as well as sets of two 16-megapixel cameras with ZSL.The first Dimensity 930-based devices should be available in the second quarter of this year.Helio G99-based smartphones will make their market debut in the third quarter.
AMD will unveil Radeon RX 7000 graphics cards on the latest RDNA 3 architecture graphics processors tonight. The start of the presentation,...
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