At the Innovation event, Intel representatives confirmed that the company is going to focus on expanding artificial intelligence capabilities in the next generation processors, code-named Meteor Lake.Image source: IntelThe hardware acceleration of AI algorithms in the processor will successfully solve such tasks as visual pattern recognition, prediction, background noise filtering when using The main goal of this article is to publish a detailed description of the hardware support for the AI unit on a Meteor Lake application, since it will allow processors to significantly accelerate the use of AI in their applications.The VPU (Versatile Processing Unit) with AI capabilities has been codenamed Movidus.According to Intel CEO Patrick Gelsinger, the implementation of AI capabilities in the new processor can be compared to the introduction of a math coprocessor for floating-point calculations in processors.He noted, \"People were saying, 'We don't need this floating-point math.' But over time, it just became the standard.So, the AI unit will be that standard and will be installed on every one of our platforms.\"Gelsinger also gave examples of what he thinks an AI-enabled Meteor Lake could accomplish: \"For example, I'm chatting in Zoom or making calls through Teams.The new processor capabilities will allow me to have a simultaneous translation or a transcript of that call.The cameras will constantly track the talking interlocutor and enhance the image.\"Image source:Mark Hachman / IDG Intel representatives also say that the new AI gas pedal will be supported by Microsoft, although in what capacity, it is not reported.\"Microsoft believes that neural coprocessors like Intel's VPU represent a tipping point in computing and will be key to providing a whole new range of capabilities for Windows users on PCs,\" Microsoft's Vivek Pradeep wrote.\"Microsoft is working closely with Intel on VPU.\"Interestingly, this is far from the first attempt to put AI capabilities into a processor.Prior to that, Intel tried to implement some AI features in the 10th generation Ice Lake processors, similar attempts were made by Qualcomm with its Snapdragon processors.However, neither of these attempts were successful.
Intel during the Hot Chips 34 conference shared fresh details about the 3D chip packaging technology that will be used in Meteor Lake, Arrow Lake and Lunar Lake processors and will allow combining several chips produced by different process technologies on one substrate.At the same time, the manufacturer has dispelled several earlier rumors about the Meteor Lake series of chips.Image source: IntelThe integrated graphics of Meteor Lake processors will not be produced using the 3nm process technology, as claimed in some rumors.According to Intel, the graphics of these processors have been designed with the 5nm process technology in mind.Meteor Lake processors will consist of multiple crystals (tiles) interconnected using Foveros bus.Intel shared a block diagram (image above) of consumer Meteor Lake with six performance and eight power-efficient cores.These cores will be part of the computing chiplet, which will be produced according to the Intel 4 (7nm) process technology.The company did not specify it, but the block diagram shown most likely belongs to the processor of the future Meteor Lake-P mobile series for compact gaming and fairly productive working notebooks.Earlier Intel showed another Meteor Lake computing chipset, presumably belonging to one of the Meteor Lake-U mobile processor models, which have two high performance and up to eight power efficient cores and will probably be equipped with less powerful integrated graphics.Intel has clarified that the SoC and I/O (IO) tiles of Meteor Lake processors will be manufactured using TSMC N6 (6nm) process technology, while the embedded graphics chip will use TSMC N5 (5nm) technology.At the same time, all chipsets will be combined by Foveros chip with Intel's 22nm process technology. Intel Meteor Lake SoC with chips on different processes.Image source: PCwatchIntel has also confirmed that the launch of Meteor Lake and Arrow Lake series processors is expected in 2023 and 2024, respectively.Chips in these series will be introduced in both mobile and desktop segments.Image source: VideoCardzThe company added that the Lunar Lake processor series, which will come after Arrow Lake, are energy-efficient solutions with a nominal TDP of 15 watts, which very likely indicates their mobile nature.Whether there are plans to release Lunar Lake models with higher TDP, the company has not yet said.
Details about Intel's Meteor Lake mobile processors have been revealed - three types of cores in one processor, new graphics and PCIe 5.0
Igor's LAB portal has published the first details about the upcoming 14th generation Intel Core mobile processors, codenamed Meteor Lake.The resource has shared a few diagrams highlighting the most important details about the future chips.It became known that Intel will release mobile Meteor Lake series H, P and U - they have different levels of TDP and are designed for laptops in different segments.Image source: IntelThe Meteor Lake mobile chips will reportedly get a new type of energy-efficient cores LP E-Core.Apparently, the question is about the Low Power Efficient Core - the least powerful cores, which will become another link in the hybrid architecture of the 14th generation Core processors.The rumors that Intel is going to use three types of cores in future chips have been circulating for some time.If true, the Meteor Lake architecture will resemble the current Arm approach, where one chip also uses three types of cores. Image source: Igor'sLABAccording to other sources, the third type of Meteor Lake cores will not be contained inside a computing chip (tile or chiplet), like high-performance P cores and energy-efficient E cores, but inside a separate SoC chip.According to Igor's LAB, the Meteor Lake-H and Meteor Lake-P processors will be the first Intel consumer processors, which will use a hybrid architecture consisting of several chips (tiles), built using different chipset technologies, and will offer up to 14 cores (6 P-core and 8 E-core).In turn, the Meteor Lake-U series models will get up to 12 cores.It is also known that the new architecture will support DDR5-5600 and LPDDR5/LPDDR5X-7467 RAM.Meteor Lake-based systems will be able to offer up to 96GB of DDR5 RAM or up to 64GB of LPDDR5 RAM. Source image: Igor'sLABIt also became known that Meteor Lake will receive a new architecture for integrated graphics - Intel Xe-LPG.In the documents it is mentioned under the name Xe2.Meteor Lake-H, P and U processors will receive up to 128 execution units of embedded graphics.It is not known at the moment whether Xe2 is a representative of the Battlemage gaming architecture, which will replace the current Alchemist graphics or whether it will be some new improved power-efficient version of Alchemist.Meteor Lake-H mobile processors, which will be used in powerful gaming notebooks, will get support for up to eight PCIe 5.0 lines.There is no mention of PCIe 5.0 support for the persistent memory subsystem.Information available to Igor's LAB also confirms that the 14th generation of Intel Core processors will debut in the second half of 2023.
Intel will release Raptor Lake-S processors in the second half of the year, which, while bringing evolutionary improvements over Alder Lake-S, will remain compatible with the LGA 1700 socket.Informed sources report that their successors will be offered in the new LGA 1851 design, which implies the use of new motherboards. Picture source: BenchLife.infoSpeaking statements are the Chinese site BenchLife.info, which has repeatedly confirmed the correctness of their predictions.The information distributed recently by a popular You-Tube channel about Intel's intentions to move processors to run with 2551 pins turned out to be only partly true.The fact is that the Arrow Lake and Meteor Lake desktop processors will be available in LGA 1851 version, while the Intel plans to move to Intel's version with 2551 pins, which will surely be combined with BGA mounting type and used in mobile segment.According to a Chinese source, the LGA 1851 CPU will retain the length and width of its predecessor in the LGA 1700 design (37.5 x 45 mm), but its mounting height relative to the motherboard will range from 6.83 mm to 7.49 mm, which is 0.09-0.1 mm more than the LGA 1700 design.Theoretically, this will maintain compatibility with cooling systems that ran on LGA 1700 processors, but things are not so clear with the clamping force due to the change in mounting height of LGA 1851 processors.In all likelihood, the processors of this generation will be a bit higher because of more complex layout, which implies placing two crystals on one substrate.Asymmetric shape of crystals, in turn, will not contribute to the even heat removal by the cooling system soleplate, so manufacturers of the latter will probably offer new revisions of their products, optimized to work with processors in the LGA 1851.Characteristically, the Chinese primary source insists that Arrow Lake-S processors will come out first, and only then Meteor Lake-S will appear, although most other sources consider the reverse sequence.
The organizers of the Hot Chip Symposium 2022 conference have shared the program of the event, which will take place at the end of August this year.Due to the ongoing COVID-19 pandemic, the conference will be held online from August 21 to 23.Confirmed guests of the event will be Intel, AMD, Arm, Nvidia.Samsung, Tesla, MediaTek and Cerebras are also expected to attend.Mobile Meteor Lake.Image source: IntelOne of the topics, which Intel plans to cover during his speech, will be a 3D packaging of chips Faveros for consumer processors.Its implementation is planned in the Meteor Lake (14th generation Core) and Arrow Lake (15th generation Core) series of chips.The Meteor Lake processors will include the chip with integral computational units, based on Intel process 4 (7nm), embedded GPU chip with 3nm TSMC process (N3), as well as the chip with interfaces (SoC-LP), based on TSMC N4 or N5 processes (different versions of 5nm technology).The Arrow Lake series, in turn, will use Intel's 20A process technology for the first time, as well as TSMC's N3 (3nm) process technology. Intel will also talk about new server gas pedals Ponte Vecchio and Intel Xeon D 2700 and Xeon D 1700 processors at Hot Chips.There will be other companies at the conference at the end of August.AMD is going to talk about the mobile Ryzen 6000.This series of chips was introduced at CES 2022 earlier this year and is just starting to appear in notebook lineups.The series consists of Ryzen 6000H processors with TDP from 35 to 45W, as well as Ryzen 6000U models with TDP of 15-28W.It is possible that AMD is going to show new chip models with TDP less than 15W at Hot Chip Symposium 2022.NVIDIA will pay attention to supercomputing.In particular, the vendor will be talking about Hopper architecture for server gas pedals and will probably also be talking about its 144-core Grace processor.Tesla has planned two presentations.During them, the company is going to talk about its supercomputer Tesla Dojo.In particular, the manufacturer will pay attention to the microarchitecture, which is used in its basis.In addition, the automaker will talk about how Dojo can accelerate machine learning.MediaTek will talk about the features of its flagship Dimensity 9000 processor series for smartphones, and Arm will discuss the details of its server hardware platform Morello with enhanced security features.
Journalists from Le Comptoir du Hardware attended the Intel Vision 2022 conference, where they got a chance to photograph the layout of one of the Intel Core 14th generation processor chips, codenamed Meteor Lake.The electron microscope lens caught the part with energy-efficient E-core computing Crestmont.Image source: Le Comptoir du HardwareThe first photos of Meteor Lake mobile processors were published earlier today.They will use several chipsets at once based on different technological processes.The Meteor Lake chips will use a hybrid architecture of large and small cores similar to the current Alder Lake chips.At the same time, mobile Core 14-generation processors will be available in two types: one will have a standard package, while the other will be significantly more compact.The former will be used in regular and gaming laptops, or in mini-PCs.The second is likely to find application in ultra-thin laptops.Crystal photo, obtained by the French technology publication, very likely shows the chiplet second, compact, variant Meteor Lake.According to rumors, these processors will offer two efficient Redwood Cove cores and up to eight energy-efficient Crestmont cores.The embedded graphics and interface blocks are not in the photo.They are part of other Meteor Lake chipsets that will eventually be combined on the same substrate using Intel's second-generation Foveros packaging technology.The chipset caught in the photo shows Crestmont cores based on the Intel 4 (7nm) process technology.According to Intel, the new node will provide over 20 percent performance gains per watt over Intel's 7 (10nm) process technology.An explanation of the image was posted by a Twitter user.The photo shows the location of L1/L2/L3 cache blocks, as well as one of the Crestmont small core clusters. Image source: Twitter / @Locuza_The Meteor Lake processors will scale desktop with a TDP rating of 125W.In other words, the series will feature a wide variety of models.Chips in the new series are expected in the second half of 2023.
Intel has shown two versions of its 14th generation Core mobile processors, codenamed Meteor Lake, at its Vision 2022 event.The chips are due to replace Raptor Lake processors next year, due for release in late 2022.Image source: Intel Meteor Lake moves away from the traditional single-chip design and will use multiple chips or tiles on a single wafer using its second-generation Foveros packaging technology.This technology was first used in the energy-efficient Lakefield series mobile processors, and is also used in Sapphire Rapids server processors and Ponte Vecchio series GPUs.At the Vision 2022 event, the company showed a standard Meteor Lake mobile processor packaging option, as well as its significantly more compact version.Each type will serve its own purpose.The first will be used in regular and gaming laptops, or in mini-PCs.The second will probably be used in ultra-thin laptops. Meteor Lake processors will include an Intel 4 (7nm) process chip with processing units, an embedded GPU chip based on TSMC's 3nm process (N3), and an interface chip (SoC-LP) based on TSMC N4 or N5 processors (various versions of 5nm process).The chips will use Redwood Cove's large computing P-core and Crestmont's small, energy-efficient E-core, and will get up to 192 executive graphics units with Intel's Xe architecture. The use of \"tiles\" provides more flexibility when it comes to choosing processor configurations.In theory, it will make it easier to increase the number of cores in the chip or opt for a more efficient integrated graphics core - it will simply require replacing the \"tile\" with a more efficient option when building the chip. Intel has also confirmed that Meteor Lake will scale to a 125W TDP rating.In other words, there will be desktop models in the series as well.However, the company has not shown them yet.According to Intel, the 14th generation of Core processors will be released in 2023.Very likely, in its second half, as the release of Raptor Lake is expected only by the end of this year.
Advertisement Intel Corporation at the \"Vision 2022\" event has shown the press samples of its 14th generation Meteor Lake processor family, which is planned to enter the market in the first half of 2023.The distinctive feature of new Meteor Lake CPU, designed for desktop and mobile systems, is their chiplet mosaic layout.An interesting point is also that the crystals connected together will be produced by different processes and in different factories.Some chips will be produced by TSMC, while others will be made by Intel itself on the Intel-4 technological node, using EUV technology (ultraviolet photolithography).The layout of processors is presented in two sizes - standard and high-density.Pictures of samples for mobile platforms show that the block consists of at least four crystals, tightly fitted to each other.It is indicated that the so-called \"southern bridge\" (PCH) has moved to a separate crystal.The general layout looks as follows: - Crystal with processor cores;- SOC crystal;- IO crystal;- Embedded graphics crystal.For processor cores it is declared an increase in performance level with reduced power consumption in comparison to previous generations.But the graphics component, as announced, will be something completely new and unlike anything we have seen before.Graphics chip tGPU, based on the new architecture Xe-HPG, will offer a completely different level of performance without increasing power consumption, if you compare it to the current iGPU.Support for DirectX 12 Ultimate, XeSS and other features currently found only in the Alchemist lineup is claimed.Post rewardedThis material was written by a site visitor, and it is rewarded.
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