Reducing dependence on TSMC and its Taiwanese facilities will be an important trend for MediaTek in coming years, as CEO of this mobile processor developer, Rick Tsai, made clear.The company's CEO explained that the main factor behind this decision will be geographical diversification, as over-reliance on Taiwan concerns not only the company, but also its customers.Large consumers of semiconductor products, according to Mr.Tsai, will begin to require chip suppliers to use multiple sources of production: Taiwan will be combined with the U.S.or Europe.MediaTek is preparing for the emergence of such requirements and is gradually expanding the geography of its chips production, not just limited to Taiwan.As over time, MediaTek expects to increase the volume of sales of its chips in the U.S.market, then the localization of production, it is ready to pay close attention.When TSMC's chip contract manufacturing facility in Arizona will start operating, MediaTek hopes to become its customer.In addition, the production of processors of this brand will be engaged in GlobalFoundries, which has enterprises in New York State and Singapore.However, in this case we are talking about the use of not the most advanced lithography, but it is more important to diversify sources.Intel, which has repeatedly reported on cooperation with MediaTek, from the second half of 2024, as explained by Rick Tsai, will provide it with chips, which will be produced by Intel 16 technology in the enterprise in Ireland.These components will find use in TVs and Wi-Fi routers, and do not require advanced lithography to produce them either.This market segment is quite large, so the company considers cooperation with Intel in all seriousness.The head of MediaTek personally observes progress in this area on an almost monthly basis.
Taiwan's TSMC is preparing to implement another project with multi-billion dollar investments - the company intends to expand the chip factory under construction in Arizona (USA).In the coming months, the chipmaker plans to announce the construction of an advanced factory north of Phoenix, next to the already under construction facilities that were announced in 2020.The volume of investments, according to some reports, will be the same as 2 years ago - $ 12 billion.Image source: Maxence Pira/unsplash.comThe company began to actively develop chip production in the U.S.after Washington has promised semiconductor manufacturers all sorts of grants and incentives for the construction of enterprises on American soil.Future plant TSMC will produce chips in accordance with the 3-nm process, one of the most advanced to date.In TSMC said that the official ceremony of installation of the first batch of equipment for the manufacture of chips at the first plant in Arizona will be held in December - the beginning of construction was announced two years ago and the beginning of production is scheduled for 2024.While previously the company was going to produce 5-nm chips in Arizona, now we are talking about more advanced 4-nm variants.Mass production should begin in 2024.The timing of commissioning of the second plant is still unknown.The expansion indirectly indicates the manufacturers' optimism about the demand for semiconductors in the long term, even against the backdrop of disappointing market indicators for the current year.Demand for some chips collapsed after two years of rapid growth during the pandemic, during which demand for computer hardware and electronics skyrocketed.Many companies, including TSMC, had to go into savings mode and cut capital spending in the short term.Despite the downturn in the industry, semiconductor company executives still expect that in the next decade, global sales will exceed $1 trillion, so intensive investment in manufacturing infrastructure continues, especially since such plans in recent years are actively supported by the United States and Europe, hoping to move the \"center of power\" semiconductor industry from Asia.Intel and Micron are also trying to save money in the short term, while investing heavily in future projects based on strong demand.This year, the U.S.has distributed grants for chip production in the amount of $39 billion; the funds themselves will be allocated from next year.In addition, it also provides tax incentives for equipment for the production of semiconductors.Europe also intends to increase its production share in the global market of semiconductors up to 20% by 2030.Large plants typically take several years to build and equip, so companies must make investment decisions in advance.Image source: Robert Murray/unsplash.comThe enormous subsidies in the US and Europe for chip production are a reflection of political leaders realizing their critical importance in the military and civilian sectors.The active development of the relevant industry in China has caused deep concern in the West, after which the U.S.stopped promoting the idea of freedom of market relations and imposed tough sanctions on Chinese companies, which include a ban on both exports to the country of advanced chips and equipment for their production.In addition, the United States and its allies are concerned that the most advanced technologies of semiconductors are concentrated in Taiwan, an island that China considers part of its territory.It is known that in addition to the U.S., TSMC is considering expanding production in Japan and allows the construction of a multibillion-dollar plant in Singapore.
MediaTek unveiled the Dimensity 9200, a 4nm flagship platform with Arm Cortex-X3, ray tracing and Wi-Fi 7
MediaTek unveiled the Dimensity 9200, a flagship mobile single-chip platform that uses the latest solutions for the mobile industry.It is the first mobile platform to use the Arm Cortex-X3 main core with ARMv9 architecture and a 3.05 GHz operating frequency.In addition to the Cortex-X3 core, the new chip uses three powerful 2.85 GHz Cortex-A715 cores and four efficient 1.8 GHz Arm Cortex-A510 cores.The new chip is manufactured according to TSMC's second-generation N4P 4nm process.Note that the upcoming Snapdragon 8 Gen 2, which will be the main competitor of MediaTek novelty, is rumored to have four core clusters: one Cortex-X3 (3.19 GHz), pairs of Cortex-A715 and A710 (2.8 GHz) and three Cortex-A510 (2.0 GHz).The second breakthrough solution in Dimensity 9200 is the advanced Arm Immortalis-G715 GPU with hardware ray tracing acceleration.The new flagship platform supports Variable Rate Shading (VRS), that is variable rate shading, which should improve performance.It also supports LPDDR5X random access memory with data transfer rate up to 8533 Mbit/s and the latest UFS 4.0 ROM.There is also sixth generation AI processing unit (APU) 690, which provides up to 35% better performance compared to its predecessor, according to ETHZ5.0 benchmark.It also features up to 30% and 45% reduction in power consumption for image noise removal and upscaling by AI.The Dimensity 9200 supports up to two displays up to 5K resolution at 60 Hz or 1440p at 144 Hz or 1080p at 240 Hz.It's also the first chipset to support Wi-Fi 7 at up to 6.5Gbps.Of course, 5G networks are supported - both up to 6 GHz and millimeter band (mmWave), Bluetooth 5.3 is also provided.The Imagiq 890 image processor is capable of handling RGBW sensors, saving 34% power compared to the previous generation variant.Finally, MediaTek eXtreme Power Saving technology is used on the basis of AI, allowing to use up to 30% less energy in general.It is expected that the first smartphones based on the Dimensity 9200 will appear on sale before the end of this year.It is known that back in spring, according to AnTuTu benchmark, smartphones based on the Dimensity 9000 chip for the first time were among the top ten most powerful, displacing Snapdragon 8 Gen 1 models.
Experts explained why electronics manufacturers are \"swimming\" in chips, while automakers suffer from chip shortages
Recently, news about a total chip shortage has been replaced by information about a mitigation of the situation.What's more, some reports suggest that TSMC is asking its employees to take a leave of absence as computer makers have noticeably reduced orders, and orders from smartphone makers have declined even further, a trend that will continue into 2023.Meanwhile, while some manufacturers are not experiencing any shortage of semiconductors, many companies are still suffering from acute shortages.Image source: МicronAs Forbes reports, while TSMC's leading customers - Apple, AMD, Intel, MediaTek, NVIDIA, and Qualcomm are constantly developing more and more advanced processors, they are currently very \"conservative\" about sales forecasts and, therefore, production orders.In other words, the leading electronics component vendors do not need many chips yet.This is not surprising, because in this sector demand is largely determined by demand for PCs, which, according to Gartner, in April 2021 rose to record levels, sales of the top six PC manufacturers grew at a double-digit percentage rate, and for some time, even triple-digit sales of Chromebooks.This trend could not last forever, and figures have already appeared on the sale of certain models of Chromebooks for literally $79 (in the US) - even components for them cost more, but the market is already crowded, and demand is satisfied for almost years to come.At the same time for the release of new models manufacturers have to free up their warehouses from old and expect high demand for components in this segment in the foreseeable future is not necessary.For example, in its latest earnings report Micron Tecnology reported that demand in the calendar year 2022 will on average be lower than supply, which will lead to a build-up of large stocks in the warehouses of suppliers.Scarcity typically initiates massive investments in building new capacity and mastering new process technologies, resulting in the occasional oversupply crisis.Surplus is observed in many industries-but not in all.In particular, there is no abundance on the market of chips for cars.The point is that most of the semiconductors for cars are produced according to the so-called \"mature\" process technologies, and most of the demand is for 90-nm semiconductors.These were considered the most advanced solution around 2002, 20 years ago.Nevertheless, they are quite in demand, since many components simply do not need ultra-modern technology, and the process of transition to it is costly and long.Image source: BMWFactories continue to use the old tools for production and, since this segment is not the most profitable, for most manufacturers there was no need to invest in new capacity.Such semiconductors weren't quite enough already by the beginning of the pandemic, and 2020 recorded about an eight-week period in which most auto factories had to partially or completely suspend operations due to sanitary restrictions, after which they withdrew their semiconductor orders.Meanwhile, explosive growth in other sectors requiring chips has put \"obsolete\" production capacity to full use, and as Forbes reports, when automakers tried to restart orders, delivery times for them catast
The day before the Taiwanese media reported that TSMC, the largest contract manufacturer of semiconductor components in the world, had already decided on the location for its most advanced facility, which will master the 1N technology production in a few years.As explained by TSMC representatives, no decisions have been made yet.Image source: TSMC According to Focus Taiwan, the original publication of the Commercial Times, citing an anonymous source, mentioned the intention of TSMC to place the new venture in the technology park Xinzhu in northwestern Taiwan.According to official reports, TSMC is undecided on the site and is still in the process of finding a suitable location on the island.As soon as the choice is made, the company promises to make the appropriate announcement.Deputy director of the technology park Xinzhu not commented on rumors about the plans of TSMC, but explained that the resident companies can choose the site in the third area of the park for the construction of production facilities, because the first place is all taken, and the second reserved for recreational areas.It is expected that the company will begin mass production of 3-nm products in the current quarter, and next year revenue from their sales will be as follows Mass production of 2-nm products TSMC will begin in 2025.The company's management did not speak about terms of mastering more advanced lithography at the last quarterly report conference, but in May there was already information about TSMC's readiness to start development of 1.4nm process.
A day ago, Bloomberg confidently reported that the computing capabilities of the Chinese company's Biren BR100 gas pedals are slightly worse than NVIDIA A100, and therefore the US sanctions will not prevent their further production.Today, the source sharply changed the rhetoric, saying that TSMC decided to suspend the shipment of these 7nm gas pedals to Chinese customers.Image source: Biren TechnologyIn summer, Biren Technology was not shy about stating that its BR100 gas pedal could challenge the NVIDIA A100.Features of Chinese product were really impressive: 77 billion transistors, 7nm process technology and spatial layout of 2.5D CoWoS, 64 GB of memory, support for PCI Express 5.0 and CXL interfaces.However, when speaking about a new wave of anti-Chinese sanctions, Biren representatives preferred to remain anonymous and claimed that their chip does not meet NVIDIA A100 level and therefore would not fall under new export tunnels.Today Bloomberg reports that TSMC refused to take risks and stopped production of Biren Technology 7nm chip gas pedals.The Taiwanese contractor still hasn't come to a final conclusion about the belonging of Biren products to the banned category of products, but the shipments will be stopped \"just in case\".Biren gas pedals are designed to work in machine vision systems, processing of natural speech and its synthesis using artificial intelligence.Representatives of the Chinese company have not yet commented on the news, according to Bloomberg.
Samsung and TSMC are facing a ban on the sale of their components and electronics in the United States
The US International Trade Commission (USITC) intends to launch an investigation against Samsung and TSMC related to alleged infringement of the companies' patent rights related to chips and mobile devices based on them.Source image: SamsungThe USITC said the agency is launching an investigation based on a complaint filed in September by New York-based Daedalus Prime LLC.The complaint alleges a possible violation of Section 337 of the Tariff Act of 1930, adopted to protect U.S.businesses from foreign competitors.The complaint is reportedly related to chips manufactured by Samsung using 14nm and newer technologies as well as chips manufactured by TSMC using 16nm and smaller technology.The investigation will also cover smartphones, tablets and smart watches that use such semiconductors.In other words, there could be a huge array of cutting-edge electronics involved.In fact, the lawsuit demands to block the import and sale of all the patent-infringing products mentioned in the complaint.A separate complaint is reportedly filed by the same company against Qualcomm.According to media reports, Daedalus Prime is a classic patent troll, owning a number of rights to products or processes without any intention of manufacturing or implementing them.Such companies make money by licensing out technologies they have acquired in various ways or by filing lawsuits.The case in question is Intel technology, the rights to which Daedalus Prime acquired earlier this year.Apparently, so far, these are only a few of the investigations initiated by the USITC at Daedalus Prime's initiative.It is assumed that the company intends to make technobusinesses pay for the use of technologies, once patented by Intel - otherwise they will be threatened with a ban on the import of electronics in the United States.However, while the USITC said that it had not yet made any decisions related to these complaints.The agency intends to review the materials and evidence and establish the violation of Section 377 in the manner prescribed by law.Meanwhile, a few months ago, Intel announced the availability of another batch of about 5000 of its patents.These are technologies whose rights have not yet expired, but which are no longer cutting edge.Nevertheless, they can still bring Intel some income.
AMD CEO Lisa Su along with a number of other senior company executives are set to visit Taiwan from late September to early November to discuss collaboration with local partners.AMD will hold talks with TSMC, as well as chip packers and major PC manufacturers.image source: amd.comIn the course of visit, Suh will meet with TSMC CEO CC Wei and, in particular, discuss about production lines N3P (3nm process) and N2 (2nm process), reports DigiTimes, citing its own sources.The executives will discuss upcoming orders using either existing or forthcoming technologies.AMD owes its success in the processor market in recent years, among other things, to TSMC's ability to produce cutting-edge products in large quantities.To build on its success, AMD needs timely access to processor design kits (PDKs).TSMC will launch mass production on N2 nodes in the second half of 2025, so AMD needs to negotiate now to incorporate the technology into 2026 products.Beyond advanced semiconductor manufacturing technology, AMD's success will also depend on packaging solutions-the company will continue to develop CPUs and GPUs from multiple chips (chipsets).Today AMD already uses several advanced solutions, but in the future the need for different packaging technologies will only grow, and it is necessary to agree in advance on the production capacity and prices.PCBs and substrates will be discussed with Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology.Finally, AMD management will meet with ASUS and Acer, Taiwan's largest PC makers and long-time partners, as well as chipset developer ASMedia.
AMD will unveil Radeon RX 7000 graphics cards on the latest RDNA 3 architecture graphics processors tonight. The start of the presentation,...