AMD has shared with partners plans for desktop processors in 2022-2023 - a \"road map\", not intended for the public, appeared on the web.Judging by the presented plan, AMD intends to continue releasing Ryzen 5000, 4000G and 5000G processors under Sunset AM4, and the powerful Ryzen Thredripper 5000 will not get successors until the end of 2023.AMD plans to introduce a new generation of high-performance desktop processors, which will replace the current Ryzen Threadripper 5000, only by the end of 2023.Their name, as well as details about the characteristics, are not specified.According to previous rumors, the new items were codenamed Storm Peak, and will probably go on sale as Ryzen Thredripper 7000.We can assume that these processors will get Zen 4 cores, DDR5 and PCIe 5.0 support, and other Ryzen 7000 features.Also, AMD will continue to produce and sell Ryzen 5000 and 5000X3D processors in parallel with the new Ryzen 7000 at least until the end of 2023.Also, AMD's slide confirms that the company is preparing Ryzen 7000X3D processors, which will be equipped with additional 3D V-Cache.Note that Ryzen 7 5800X3D is currently the only desktop processor with extended 3D V-Cache.And it is one of the company's fastest solutions for gaming, overtaking in some cases even the newly released Ryzen 7000.So maybe the release of Ryzen 7000X3D processors will allow AMD to strengthen its position in the gaming area.Finally, AMD plans to update Ryzen G-series desktop hybrid processors, which feature quite productive integrated graphics, by the end of 2023.They will probably join the Ryzen 7000G series and offer a combination of Zen 4 cores and RDNA 2 or RDNA 3 graphics.At the same time AMD will continue to produce the current desktop hybrid Ryzen 4000G and 5000G processors, even after the release of new products.Thus it turns out that at least until the end of 2023, the Socket AM4 platform will not lose relevance.
Performance data for the AMD Ryzen 9 7900X 12-core processor has appeared in the Geekbench 5 synthetic test database.It remained the only chip in the new Ryzen 7000 line of processors for which no independent performance tests were published in this benchmark.Earlier leaks confirmed the performance of the six-core Ryzen 5 7600X, the eight-core Ryzen 7 7700X and the flagship 16-core Ryzen 9 7950X.Image source: WccftechThe Ryzen 9 7900X has a base frequency of 4.7 GHz.On one of the eight cores, it can automatically overclock to 5.6 GHz.The chip has a claimed TDP of 170W, 76 MB of cache memory (64 MB of L3 and 12 MB of L2) and supports 24 virtual threads. Image source: GeekBenchThe processor was tested with Gigabyte X670E Aorus Master motherboard equipped with 32 GB of DDR5 memory.The chip scored 2167 points in single-core test and 18,622 points in multi-core test.Novelty on Zen 4 architecture was 30% faster in single threaded and 33% faster in multi-threaded tests than its predecessor, Ryzen 9 5900X.In comparison with Core i9-12900K new AMD chip was also faster.Intel's still current 16-core flagship scored 1,901 and 17,272 points in the same tests, respectively.Compared to engineering samples Core i7-13700K and Core i9-13900, Ryzen 9 7900X processor is faster in single threaded performance, but inferior in multi-threaded performance.Comparison table for single threaded performanceAmd Ryzen 7000 processors and motherboards for new Socket AM5 platform on senior AMD X670E and X670 chipsets will go on sale September 27.
Ryzen 9 7950X results hit the Geekbench database, and they are worse than the engineering Core i9-13900K
Geekbench synthetic test database has posted performance test results for the flagship 16-core Ryzen 9 7950X processor.Previously reported performance in the same benchmark of the junior six-core Ryzen 5 7600X model.Image source: AMDRyzen 9 7950X was tested on ASUS ROG Crosshair X670E Extreme motherboard paired with 32GB of DDR5-6000 RAM.As part of the test, the processor automatically overclocked to 5759 MHz, just above the manufacturer's claimed 5.7 GHz.Ryzen 9 7950X has 16 physical cores with support for 32 virtual threads.The same number of cores have still current flagship processors AMD Ryzen 9 5950X and Intel Core i9-12900K.At the same time the new AMD chip has fewer cores than the future flagship Core i9-13900K processor.The latter will be equipped with 24 physical cores, but 16 of them are energy efficient and do not support Hyper-Threading.Ryzen 9 7950X specifications.Source: Geekbanksh In the single-core performance test, the Ryzen 9 7950X scored 2,217 points.This is just below the result announced by AMD itself (pictured below).Multi-core performance index of the chip is 24,396 points.AMD declared Ryzen 7000 processor performanceMost models of future Intel Core 13th generation processors have already been tested in this benchmark (though, as engineering and qualification samples), the results of new AMD product can be compared with them.Ryzen 9 7950X performance.Source: GeekbenchThe most recent entry in the Geekbench 5 database shows single-core performance of the Intel Core i9-13900K Raptor Lake series is 4.4 percent better.The multi-core performance of the Intel chip is 8.8 percent higher than the Ryzen 9 7950X.At the same time, the new AMD processor is 31 and 47.8% faster in single-threaded and multi-threaded tasks than the Ryzen 9 5950X, and 14.5% and 41.2% faster in the same tests than the Core i9-12900K.Image source: VideoCardzIt should be recalled again that only engineering and qualification samples of 13th generation Intel Core processors took part in Geekbench tests.This means that their final performance figure may differ from the performance of the off-the-shelf consumer variants.
At last night's \"together we advance_PCs\" event, where AMD presented the Ryzen 7000 series desktop processors, some details about the company's future plans were revealed.In particular, the next architecture after Zen 4, Zen 5 will come to the market in 2024.As for the near future, the next big processor announcement from AMD is scheduled for next year - the beginning of next year, the company intends to present a family of mobile Ryzen 7000 processors based on the Zen 4 microarchitecture.Moreover, Mark Papermaster, AMD's technical director, promised during his speech that the Ryzen 7000 processors with additional 3D-cache chip (V-Cache), such as Ryzen 7 5800X3D, will be presented in the future.On the other hand, he refused to give a definite date for Zen 4 server versions with 3D V-Cache technology, but the timing was more definite: these processors will appear in early 2023.At the same time should go and designed for high-density servers processors EPYC Bergamo with Zen 4c-core - these chips, recall, will receive up to 128 cores, while the usual EPYC Genoa with the traditional architecture Zen 4 will be limited to 96 cores.Also AMD representatives mentioned the family of processors Ryzen Threadripper.According to David McAfee, vice president and general manager of customer channels, AMD is looking very closely at releasing Ryzen Threadripper processors on the Zen 4 architecture.However, due to changes in demand patterns and supply chains, we can only talk about variants \"without maximum configurations like Threadripper Pro, but with a broader lineup.\"In addition, David McAfee promised that the Ryzen 7000 desktop processor family will not be limited to four models and will expand.Additional processor models, covering a wider range of price categories, will be released early next year.As for the more distant prospects, the next to Zen 4 architecture Zen 5 is planned by AMD at the end of 2024, the processors based on it will be produced on the 4-nm process technology.According to Papermaster, Zen 5 is a \"complete redesign of the core with further optimizations for AI tasks.\"Along the way, AMD representatives have promised that the new platform Socket AM5, which comes out with the Ryzen 7000 processors, will remain relevant at least until 2025.And this means that motherboards with socket AM5 will support not only Ryzen 7000, but also promising Ryzen processors based on Zen 5 architecture.
AMD has officially introduced the Ryzen 7000 family of desktop processors.It includes four models with 6, 8, 12 and 16 cores with the new Zen 4 architecture.Their sales will start on September 27.Ryzen 7000 processor family includes four models:Ryzen 9 7950X: 16 cores, 4.5-5.7 GHz, 64 Mbytes L3-cache, 170 W TDP, price - $699;Ryzen 9 7900X: 12 cores, 4.7-5.6 GHz, 64 Mbytes L3-cache, 170 W TDP, price - $549;Ryzen 77700X: 8 cores, 4.5-5.4 GHz, 32 Mbytes L3-cache, 105 W TDP, price - $399;Ryzen 5 7600X: 6 cores, 4.7-5.3 GHz, 32 Mbytes L3-cache, 105 W TDP, price - $299.The main advantage of the new family over the Ryzen 5000 series desktop processors AMD calls increased performance.According to the official data, the Zen 4 microarchitecture provides a 13 percent increase in IPC (specific performance per clock), plus an additional boost in performance gives the clock speed.It has increased up to 5.7 GHz in single threaded mode, which is 800 MHz higher than the maximum frequency of the Ryzen 5000 series.During the presentation AMD said that the older model in the family, Ryzen 9 7950X, is faster than the previous flagship processor, Ryzen 9 5950X, by an average of 40% in demanding applications for creating and processing digital content and 21% - in modern games (at 1080p resolution).Besides this AMD promises superiority in performance of its new 16-core flagship and over Core i9-12900K.According to the company's own tests Ryzen 9 7950X beats it by about 45% in content creation applications and about 9% - in games.Separately it was mentioned that even the junior model in the family - six-core Ryzen 5 7600X - has an average of 5% better gaming performance compared to the competitor's older processor.AMD also paid attention to energy efficiency of new products.The Ryzen 9 7950X is said to be 62% more energy efficient than the Ryzen 9 5950X for equal performance.And when power consumption of these processors is equalized, Ryzen 9 7950X is 49% faster.If we compare with Core i9-12900K, the claimed superiority of 16-core novelty in energy efficiency is up to 47%.Recall, the underlying Ryzen 7000 microarchitecture Zen 4 is a sequential upgrade of Zen 3.As part of it, the main eight-core CCD chip Zen 4 moved to the TSMC N5 process, which allowed AMD to increase its silicon budget to 6.57 billion transistors (versus 4.15 billion in Zen 3).The additional transistors were aimed at doubling the L2 cache size to 1 Mbyte per core, as well as a 1.5-fold expansion of the microoperations cache and implementation of AVX-512 instruction set support (VNNI).Also significant improvements in Zen 4 were made in the input part of the execution pipeline - the bottleneck in the Zen 3 architecture.This, according to AMD estimates, is what provided the lion's share of the 13 percent increase in IPC.Changes have also affected the Ryzen 7000 IO-chip.Its production is switched to TSMC N6 technology, and now it supports PCIe 5.0 bus and DDR5 memory, and has an integrated graphics core with RDNA2 architecture.Because of these changes, as well as increased power consumption limits, Ryzen 7000 processors need new motherboards with Socket AM5 processor socket, which can provide up to 230W of power.All four Ryzen 7000 processors will go on sale September 27 with Socket AM5 motherboards based on the flagship X670 and X670E (Extreme) chipsets.Mid-range chipsets based on B650E and B650 should be expected on the shelves in October.Along with that, memory vendors will release DDR5 SDRAM kits up to 6400 MHz, optimized for Ryzen 7000 and with support for EXPO timings profiles.
Less than 24 hours to go until AMD's event to unveil its next generation desktop processors, the Ryzen 7000 series chips.The novelties will offer a new architecture, will use a completely new platform, and a lot of other advantages.The presentation will be held this coming night, beginning at 2:00 Moscow time on August 30.You can follow the event via official AMD YouTube channel.AMD company has already announced some details about the upcoming products in May.It is known that Ryzen 7000 processors will be based on a new Zen 4 architecture, and their chips with cores will be made by 5-nm process technology.Yes, new items will inherit the layout of several crystals from their predecessors.Separate chip with I/O interfaces will be produced by 6-nm processor.From previous AMD announcements we know that architectural changes will provide IPC (instructions executed per clock) increment only by 8-10%.But thanks to transition from 7nm to 5nm process technology was able to significantly increase clock speeds.AMD itself promised that Ryzen 7000 will be able to automatically overclock above 5.5 GHz.Obviously, we are talking about dynamic overclocking of individual cores, but still the level is impressive.And the rumors were pointing at 5.7 GHz.As a result, single-core performance should increase by more than 15%, and overall performance (multi-core) will increase by more than 35%.And AMD also promised a significant improvement in terms of power efficiency - the increase in performance per watt will be more than 25%.At the same time, the TDP level will be up to 170 W, which is noticeably higher than the previous maximum 125 W.AMD is expected to unveil only four models.These will be the 16-core Ryzen 9 7950X, the 12-core Ryzen 9 7900X, the eight-core Ryzen 7 7700X and the six-core Ryzen 5 7600X.Of course, SMT (two threads per core) support will be provided in all cases.It is also reported to support AVX-512 instructions.A notable feature of the new generation of AMD Ryzen will be the presence of integrated graphics in all desktop models - previously it was only in the desktop chips Ryzen G-series.There will be applied graphics on RDNA 2 architecture.Another important difference Ryzen 7000 from its predecessors will be the fact that they will work with a completely new CPU socket AM5.This is a LGA socket with 1718 pins.New socket allows to support the latest DDR5 RAM, as well as PCIe 5.0 interface for both graphics card and M.2 SSD.AMD has introduced three chipsets for new motherboards with Socket AM5: the flagship X670E, the powerful X670 and the average B650.AMD partner manufacturers have already introduced many different motherboards for the upcoming Ryzen 7000.By the way, new CPU socket will be compatible with most coolers for Socket AM4.
AMD will release 4nm mobile processors with Zen 4 and RDNA 3 next year, and Zen 5 and RDNA 3+ cores in 2024
At an analyst event, AMD shared plans for various areas, including mobile processors.The company named code names for future generations of processors, outlined their release dates, processors and architectures for both processor components and graphics. At the moment, the most advanced AMD mobile processors are representatives of the Ryzen 6000 Rembrandt family.They combine the processor core Zen 3 + and integrated graphics RDNA 2.These chips are made by 6-nm process technology.Sometime next year, AMD intends to release a 4-nm mobile chips Phoenix Point, consisting of several chips, combining the new processor architecture Zen 4, as well as the new graphics RDNA 3.In addition these chips will be equipped with the Artificial Intelligence Engine (AIE).Details about its features and capabilities is not available now, but it is known that its creation is the responsibility of Xilinx, recently acquired by AMD.It is noted only that AIE will get a scalable architecture with local memory, and will be able to offer high performance and efficiency in the work with AI and signal processing. And by the end of 2024 AMD plans to release Strix Point mobile processors, which will combine the Zen 5 architecture and integrated RDNA 3+ graphics.The latter will apparently not differ much from RDNA 3, probably offering better performance per watt.These processors will also get a dedicated AI engine from Xilinx.The Strix Point manufacturing process is not specified, but it is noted that it will be more advanced than the 4nm.
At an event for financial analysts, AMD not only talked about the innovations and performance levels Zen 4 processors, but also looked ahead to a more distant future with Zen 5 processors expected to be released by the end of 2024, including a new 3nm processor architecture.Source image: AMDThe enlarged picture of AMD plans on processor architectures development was revealed by the company's technical director Mark Papermaster.First of all, the Zen 4 and Zen 5 architecture processor families will also include models with 3D V-Cache memory.Since this slide makes no distinction between client and server processor architectures, Zen 4c and Zen 5c architecture carriers are also placed in line with the rest.Logically, they should be offered in the server segment, offering processors optimized in terms of specific performance for servers with a high density layout.Image source: AMDIt is noteworthy that the processors of Zen 4 generation will be available in both 5-nm and 4-nm technology.For the Zen 5 generation, a combination of 4nm and 3nm technology will be relevant.Whether it will manifest itself as part of specific models, or lithography steps will replace each other sequentially during the lifecycle of the processors, is not specified.In principle, the chip layout allows for both options.The debut of the Zen 5 architecture is tied to 2024.It is reported to be a new architecture from an evolutionary perspective that will offer new optimizations for artificial intelligence and machine learning systems.Both performance and energy efficiency will be improved.Image source: AMDIn the press release for the analyst event, AMD mentions the code names of the future generations of processors.So, in the mobile segment, Phoenix Point 4nm processors combining Zen 4 computing architecture and RDNA 3 graphics will debut in 2023.In 2024, they are expected to give way to Strix Point processors with Zen 5 architecture and integrated RDNA 3+ graphics.As it is specified, Phoenix Point processors will use chipset layout, which AMD has neglected until now in the mobile segment.Technological process of Phoenix Point components production is not specified, but it is marked that it will be more advanced than the 4-nm.Image source: AMDIn desktop segment processors should be replaced by Granite Ridge processors with Zen 4 architecture, but their announcing dates are not specified.It is clear only that they will come out before the end of 2024.As part of the architecture Zen 4 will be presented before the 5nm Ryzen Threadripper family processors.Moreover, Ryzen 7000 family will include models with 3D V-Cache memory.
During a meeting with financial analysts yesterday, AMD revealed more details about future processors built on the Zen 4 microarchitecture.According to AMD, the new microarchitecture will be able to offer IPC improvements in the range of 8 to 10 percent, depending on the application, compared to Zen 3.Thus, the claims made at Computex 2022, which talked about a 15% single-threaded performance gain, were based on estimates that included not only progress in the microarchitecture, but also increased clock speeds plus a move to faster DDR5 memory.However, yesterday's presentation confirmed the old estimates as well, adding clarity to their interpretation.AMD has once again promised for the upcoming Ryzen 7000 16-core series a single threaded performance increase of over 15% and a multi-threaded performance increase of over 35% over the Ryzen 9 5950X.These estimates are based on Cinebench benchmarks for processors running at or near their target (or close to it) clock speeds, and AMD has also promised a more than 25 percent advantage of the future 16-core processors over the current 16-core processors in terms of specific performance per consumption.Moreover, AMD has confirmed that Zen 4 processor family will feature 3D-cache models as well.And among them there will definitely be models for the desktop segment, but what positioning and the number of cores is unknown.
Rumor: Ryzen 7000 will get performance gains of 7 to 10% per clock and can automatically overclock to 5.85 GHz
AMD plans to release Ryzen 7000 processors with Zen 4 architecture only this fall, so at the May event limited itself to mentioning only general characteristics of the new family.Performance gains in single-threaded applications of more than 15% and the ability to automatically raise the frequency beyond the 5 GHz limit hit the AMD presentation, but these are very conservative estimates, as knowledgeable sources convince.Image source: AMDThe young and ambitious website Angstronomics continues to gain the trust of the audience through important news about AMD products.According to the source, the internal goal for the company is to increase performance per clock-cycle in single-threaded loads by 7% when moving from Zen 3 to Zen 4, and in multi-threaded loads the increase can reach all of 10%.Taking into account that clock speeds will also increase, the actual performance gain will be higher than these limits.Besides, when actively working with RAM, DDR5, which support for AMD debuted under Zen 4 architecture, will have an advantage.In the description of Ryzen 7000 processors' frequency response the primary source reminds about the ability to run up to 5.55 GHz including unattended liquid cooling system, but without manual overclocking.Adding to the intrigue is a statement from the Angstronomics site about the existence of a Raphael model with a maximum frequency of 5.85GHz, which is achieved by one or more cores as a result of automatic overclocking.The source also explains the reasons why AMD has no plans to release Raphael models with more than sixteen cores.Initially, Socket AM5 platform was designed with Socket AM4 cooling system compatibility with the new CPU socket in mind.For this reason, the latter had to keep the same geometric dimensions, and the transition to the LGA design forced the company to move the front side of the substrate condensers.In turn, this required the use of an unusually shaped heat spreader cover with rectangular cutouts for \"islands\" with capacitors.All this severely limited the possibility to place additional crystals on the substrate for Socket AM5 CPUs, therefore, computing cores are distributed only in two crystals, eight pieces each.Increasing the number of cores within the existing 5-nm process technology, taking into account the increase in the second level cache capacity, is not possible.
AMD's opening event at Computex 2022 included a demonstration of the Ryzen 7000 series Socket AM5 CPU in Ghostwire: Tokyo.An engineering sample of the 5nm processor reached frequencies of 5.2 to 5.5GHz \"across multiple cores\" using liquid cooling.The company claims that he was not forced overclocking.Image source: AMDIf the fact of using unattended liquid cooling system Asetek with radiator size 280 mm and two 140-mm fans was detected while studying AMD press release, the description of the number of active cores in these modes was made by Technical Marketing Director Robert Hallock (Robert Hallock) during an interview with PCWorld resource after the event, opening Computex 2022.The main questions were whether the additional, manual overclocking p The first question was answered in the negative by Robert Hallock, who said that the Ryzen 7000 sample CPU showed \"natural frequencies\" of 5.2 to 5.5 GHz in the mentioned game.By the way, it should be mentioned that AMD web page on Computex 2022 events shows the frequencies of Zen 4 processors in Max Boost mode more than 5.0 GHz.This implies that a single processor core is guaranteed to work in that range under the appropriate load nature.Returning to the topic of the number of active cores, Hallock added that frequencies from 5.2 to 5.5 GHz were reached by a significant portion of them, and at times all processor cores worked at some of the frequencies in that range.Much will depend on cooling conditions, the nature of the load, and the capabilities of the particular motherboard.To prepare for Computex 2022 demonstration, the company used some reference board based on AMD X670 chipset and two DDR5-6000 (CL30) RAM modules with 2 × 16 GB capacity.
As expected, AMD today unveiled a new generation of processors at Computex 2022 - Ryzen 7000.Featuring integrated RDNA 2 graphics, new design for Socket AM5, new memory and interfaces, these new products are the world's first 5nm desktop CPUs and will offer up to 16 Zen 4 cores, with twice the amount of L2 cache per core compared to their Zen 2 or Zen 3 predecessors - 1MB per core.About the third level cache is not reported, as well as the prospects of the chips on Zen 4 with additional 3D V-Cache.Another important detail of the new chips will be a significant increase in clock speeds.AMD indicates that the frequency in auto overclocking mode (Max Boost) will be higher than 5 GHz.In addition, the presentation showed how a 16-core sample Ryzen 7000-series processor was able to provide in the game Ghostwire: Tokyo above 5.5 GHz, which is very impressive.True, for its cooling, it used a JHL.AMD noted that the new processors will provide a single thread performance gain of more than 15% (compared to the Ryzen 9 5950X in Cinebench R23).The acceleration will provide increased cache, higher frequency and architectural improvements, which should bring an increase in IPC (number of instructions executed per clock).Unfortunately, AMD did not specify what kind of IPC boost the Zen 4 architecture itself will provide.Additional instructions, accelerating processors in artificial intelligence and machine learning systems, are also provided.Ryzen 7000 processors, like their predecessors, consist of three crystals.Two of them are made on 5-nm TSMC process technology and contain processor cores with Zen 4 architecture.The third chip is the chip with IO interfaces, which is in contrast to the similar chip in the CPUs of past generations, is made by 6nm process technology instead of 12nm.But a much more important difference between the new crystal IO is that it has a built-in graphics processor.So every AMD Ryzen 7000 desktop processor will be able to offer at least basic integrated graphics.Previously, the usual Ryzen desktop did not have \"embedded\", and only Ryzen G-series chips had them.Another important feature of the new IO chip is support for new standards.We are talking about support for DDR5 memory, as well as PCI Express 5.0 bus.Thus, AMD has caught up with Intel in terms of support for modern technologies in CPUs - the \"blues\" have the specified memory and bus support Alder Lake-S, introduced at the end of 2021. The new chips are created for the new socket AM5 and this is the first socket change for Ryzen processors - all previous generations, from Ryzen 1000 to Ryzen 5000, used Socket AM4.New socket, among other things, is just needed to support DDR5 and PCIe 5.0.It should be noted that with the new CPU socket AMD finally moved away from unloved by many people connection of PGA type with stems on CPU, and changed over to LGA design - stems are in the socket itself, and on CPU only pads, as Intel has for many years.Chips with TDP up to 170W are supported, and compatibility with Socket AM4 coolers is retained.AMD has not yet introduced individual models of Ryzen 7000 processors, as well as did not specify a release date.It was noted only that the new generation Ryzen will debut this coming fall.
Official details about AMD's Raphael family processors will no doubt be presented by company head Lisa Su at the opening of Computex 2022 today, but so far leaks from the official presentation suggest that they will outperform their predecessors by 15% or more in single threaded applications.Source image: VideoCardzThe Ryzen 7000 family will offer a combination of Zen 4 architecture, DDR5 memory support and PCI Express 5.0 bus.To work with new processors will require motherboard socket AM5 (LGA 1718), but the former cooling system for Socket AM4 will remain compatible with them.The TDP limit for the platform as a whole will be increased to 170 W, but it is not yet possible to say that such limit will be achieved within the Ryzen 7000 family.The processors with the Zen 4 architecture will receive a doubled to 1 MB of cache memory per core, and the maximum frequency in auto-tuning mode will exceed 5 GHz.In single threaded applications the performance gain will be more than 15%, although this statement still needs to be explained in more detail by the authors of the presentation.Finally, along with the architecture Zen 4 will be implemented additional instructions for working with artificial intelligence.Under the cover of the heat spreader, which will get a new shaped form due to the need to envelope located on the PCB microelectronic elements, will be located three crystals.Two of them will be manufactured at 5nm by TSMC and will carry processing cores, while the third will integrate memory controllers and PCI Express 5.0 bus, a power management subsystem, as well as integrated graphics of RDNA 2 generation.This chip will be produced by 6-nm technology, which in general should give the processors optimal thermal performance and power consumption.The announcement of Ryzen 7000 processors is scheduled for this fall, and so far we can only dream of more specifics.
AMD CEO Lisa Su will be giving a keynote speech at Computex 2022 this coming Monday, May 23.Today, she gave a reminder of the upcoming event and hinted at the topics that will be touched upon there.In her tweet, Ms.Su noted that she will share details about \"the latest in high-performance computing from AMD and its partners.\" The picture with the picture of AMD Ryzen processor in new Socket AM5, which was taken during one of Liza Suh's previous presentations, accompanies this message.Thereby we get a clear hint that in a few days we will hear the latest details about AMD Ryzen 7000 series processors, built based on the new Zen 4 architecture and designed in socket AM5.Recall, these processors will bring not only fresh architecture with better performance, but also the support for DDR5 memory, and probably PCIe 5.0 interface.
AMD first introduced the Instinct MI100 computing GPU based on CDNA architecture in 2020 as a competitor to Nvidia A100 to accelerate high performance computing (HPC) workloads.Later, the CDNA 2-based Instinct MI200 and MI250X also appeared.Now some information has emerged about the upcoming Instinct MI300 based on the CDNA 3 architecture.Advertisement The information comes from AdoredTV, which has obtained an internal slide detailing the Instinct MI300.According to the leaked slide, the Instinct MI300 will actually be an APU with a Zen 4 architecture processor working together with a GPU and shared HBM memory. Insider @Komachi_Ensaka first tweeted about a big APU for the MI200 in December 2019, followed by a September 2021 tweet from @ExecuFix pointing to a new socket called SF5 supporting the MI300.However, AMD has been considering the concept of a megaexascale APU with 32 CPU cores, a GPU and DRAM memory since 2015 and even published an article titled \"Design and Analysis of an APU for Exascale Computing\" in 2017. The recently leaked slide correlates well with the above information.Zen 4 and CDNA 3-based APUs are expected to be completed by the end of May, with the first working sample in labs expected by the third quarter.This would make it the largest exascale x86 APU for high-performance computing and data centers. While this information is likely true, it is unclear whether AMD will build all CDNA 3 gas pedals as APUs or produce GPUs and APUs separately.The post is rewardedThis material was written by a site visitor and is rewarded.
According to information available today, AMD's upcoming Ryzen 7000X desktop processors on Zen 4 architecture will be launched this September, the first samples are already being tested, with mass production scheduled for June.A preliminary sample recently appeared in the Openbenchmarking database.It has been tested in a Linux environment (Ubuntu 20.04), and it looks like most of the tests focused on the embedded GPU.In addition, Moore's Law Is Dead published expected performance gains for Ryzen 7000X models.Advertisement OpenBenchmarking database records show an 8-core, 16-thread processor codenamed OPN 100-000000666, which matches the previous January leak.Apparently, the chip was tested May 4 on the AMD Splinter-RPL AM5 reference platform, and its maximum clock speed can reach 5.21 GHz.Resource Videocardz notes that the iGPU has the identifier GFX1036, which is a new variant belonging to the Beige Goby/Yellow Carp/Van Gogh family.There is also a Radeon HD audio codec, borrowed from the recently released Ryzen 6000 mobile processors. Unfortunately, the tests were not conducted at maximum GPU clock speeds, so you can't really compare the results with similar models from Nvidia and Intel.According to Videocardz, Ryzen 7000X iGPUs are not designed for gaming, but they should offer basic multimedia capabilities. The IPC increase of the Zen 4 chips over the Zen 3 is expected to be between 15 and 24 percent, about 6 percent higher than the Zen 3 over the Zen 2.The increase in clock speeds will also give an increase of 8 to 14 percent.All of this combined could result in a 28 to 37 percent performance increase in single-core mode, and the performance gains in multithreaded mode will be even higher.AMD is also increasing to 1MB of L2 cache per core instead of the previous 512KB, and by default the new processors will support RAM speeds up to DDR5-5200.Rewarded for the postThis piece was written by a site visitor and is rewarded.
A fresh leak from the Geekbench synthetic test database indicates that AMD's Zen 4 server processors will get 1 Mbyte of L2 cache per core. This is confirmed by tests of an engineering sample of one of the EPYC Genoa series processors. Since AMD Ryzen desktop processors are made up of the same chipsets as the EPYC server chips, the presence of doubled L2 cache memory will probably be true for the Ryzen 7000 models on Zen 4 as well.
The aforementioned Genoa series chip with OPN number 100-000000479-13 has 32 physical cores on board with support for 64 virtual threads, and runs at a base frequency of 1.2 GHz. Considering that this is a very early engineering sample, it's safe to assume that the market version of the processor will have a much higher frequency. According to Geekbench data, the tested chip has one megabyte of L2 cache per core, which is twice the size of Naples, Rome and Milan series EPYC processors. At the same time the new chip has 32 Mbytes of L3 cache per chip compared to the same Milan series processor (CCX unit with 8 cores). But since Genoa series processors will be able to offer up to 96 physical cores, the total L3 cache volume will in any case be higher than that of their predecessors. The only exception will be the newer EPYC Milan-X chips, with 3D V-Cache technology, which triples the cache size. It should be recalled that EPYC 7004 (Genoa) processors will be manufactured according to the 5-nm process technology. They will be the first AMD server processors, which will support DDR5 RAM, as well as PCIe 5.0 interface. According to AMD, these chips should go on sale this year. The company's partners are already receiving samples for testing.
AMD will introduce for AM5 platform AMD RAMP profiles - Intel XMP 3.0 analogue for DDR5 overclocking
AMD will introduce the AMD RAMP (Ryzen Accelerated Memory Profile) overclocking tool for the AM5 platform. The technology will be the successor to solutions such as A-XMP and AMP (AMD Memory Profile), and will be analogous to the XMP 3.0 profiles that Intel uses to automatically overclock DDR5 RAM beyond JEDEC stated specifications in Alder Lake-based systems.
Rumors about AMD's RAMP development began to circulate right after AMD showed off a sample Ryzen 7000 (Raphael) desktop processor on the Zen 4 architecture at CES 2022. One of the developers of PC monitoring software HWiNFO shared a little more information about it in a conversation with ComputerBase. The latest beta version of this software (7.17) includes AMD RAMP pre-release support. The author of the application pointed out that AMD RAMP stands for AMD Ryzen Accelerated Memory Profile. According to him, the feature is designed to overclock DDR5 memory modules similar to Intel XMP 3.0 profiles.
Since most memory manufacturers today add support for Intel XMP profiles to their products, we can assume that AMD's counterpart will work in a similar way. Moreover, it is very likely that both technologies will be interchangeable. In other words, DDR5 modules that get AMD RAMP support will probably also work with Intel XMP 3.0 profiles. However, AMD will likely also enlist the support of some RAM manufacturers to release exclusive memory modules for it, as it did in the past;
In the past, AMD A-XMP and AMP (AMD Memory Profile) for RAM were not as widespread as Intel XMP. For this reason, some motherboard manufacturers offered their own solutions for memory overclocking on AMD platforms. For example, ASUS uses DOCP (Direct Overclocking Profile) and Gigabyte uses EOCP (Extended Overclocking Profile). Many other memory overclocking solutions utilize Intel XMP profiles, which are known to work not only on Intel motherboards, but also on AMD ones. Whether AMD RAMP will be popular among manufacturers & ; depends primarily on how popular will be the entire AMD AM5 platform and Ryzen 7000 processors in general. Recall that their release is expected in the second half of this year.
Talking with journalists from Anandtech portal AMD chief executive Lisa Su once more confirmed that the Zen 4 processors will use 5nm production process technology. In addition, Ms. Su for the first time reported that the processors on the new architecture will use chipsets in 2D-and 3D-layout. This could mean that some processors on Zen 4 could get 3D V-Cahce cache.
Journalists asked why AMD decided to use TSMC's 5nm process, while some companies, including mobile, are already using 4nm and will soon be switching to 3nm chips. Lisa Su explained that for certain tasks use their own processes. If we talk about the Zen 4 architecture, the most appropriate would be to use the 5-nm process, as it is optimized for high-performance computing. The fact that TSMC has three versions of 7nm process already hints at the fact that the most advanced nodes are not a universal choice for the production of all types of chips. By the way, TSMC said it has already accepted advance payments for $5.44 billion in orders from 10 customers, including AMD, Apple, NVIDIA and Qualcomm. With these payments, they have reserved manufacturing slots for their products at TSMC's facilities. In the first three quarters of last year, the contract chipmaker received advance payments of $3.8 billion. According to TSMC, the volume of such deals will increase as long as demand in the electronics market exceeds supply.
Head of AMD company Lisa Su participated in a big interview, where, in particular, the topic of the future Socket AM5 desktop platform was touched. The upcoming Ryzen 7000 processors, which are expected to be released in the second half of this year, will use this platform.
In particular, journalist Paul Alcorn of Tom's Hardware asked whether the company plans to provide long-lasting support for the AM5 platform, as it did for the still current Socket AM4 platform. According to Lisa Suh, the future AMD AM5 platform "will get a long life". However, the head of AMD did not specify how many years in question. It should be recalled that the AMD Socket AM4 platform debuted simultaneously with the first generation of AMD Ryzen processors in March 2017. Since then, it remains the main for the manufacturer, and the company is still releasing new products for it. Take for example the recent announcement of the Ryzen 7 5800X3D processor with 3D V-Cache technology, which is expected to be released this spring. The AMD AM4 platform was designed with a large margin, with support for dual channel DDR4 memory and up to 28 PCIe lanes. Initially these were PCIe 3.0, but with the release of chips on Zen 2 and the 500 series of AMD chipsets, the platform gained PCIe 4.0 support. The change to Socket AM5 is due to the transition to a new generation of DDR5 RAM with support for four 40-bit channels and the introduction of the PCIe 5.0 interface. "We are very pleased with how the AM4 platform has evolved. We initially said it would get long-lasting support. That's what eventually happened. But with the advent of new technologies, it was time for a platform change. I can't say exactly how many years the new AM5 platform will be supported, but I can say that support will be as long as AM4. I believe that the AM4 platform will stay on the market for a few more years and will play a role of an alternative solution to some extent", commented Lisa Su.
AMD will unveil Radeon RX 7000 graphics cards on the latest RDNA 3 architecture graphics processors tonight. The start of the presentation,...