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Micron will pull Japan up to the level of Taiwan - production of DRAM on the most advanced technological process will start there too
Thermaltake introduced the Divider 370 TG ARGB with three fans
Antec has released the DF700 Flux White case with a wave-shaped front panel
Morgan Stanley analysts think that Intel underestimates the difficulties of contract business development
AMD will release 4nm mobile processors with Zen 4 and RDNA 3 next year, and Zen 5 and RDNA 3+ cores in 2024
Radeon 6700 video card went on sale without official AMD announcement
Thermaltake unveiled the relatively compact Divider 170 TG ARGB
Xigmatek Duke PC case has two tempered glass panels
AMD will release HEDT Ryzen Threadripper 7000 processors based on Zen 4 in 2023
Automotive components supplier Denso is thinking about spinning off its chip business into a separate company